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Intel's new Atom Microarchitecture: The Tremont Core in Lakefield
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[Image: Lake_678x452.jpg]

While Intel has been discussing a lot about its mainstream Core microarchitecture, it can become easy to forget that its lower power Atom designs are still prevalent in many commercial verticals. Last year at Intel’s Architecture Summit, the company unveiled an extended roadmap showing the next three generations of Atom following Goldmont Plus: Tremont, Gracemont, and ‘Future Mont’. Tremont is set to be launched this year, coming first in a low powered hybrid x86 design called Lakefield for notebooks, and using a new stacking technology called Foveros built on 10+ nm. At the Linley Processor Conference today, Intel unveiled more about the microarchitecture behind Tremont.

For the sake of clarity, a pre-note on ‘Core’ vs ‘core’:

* ‘Core’ and ‘Atom’ are Intel’s two main x86 microarchitecture families
* A ‘core’ is a single designated CPU capable of processing instructions, and can be built by Intel with either ‘Core’ or ‘Atom’ microarchitectures

A Brief History of Atom

Intel’s lower powered Atom microarchitecture has been used for a variety of solutions: embedded platforms, networking, smartphones, tablets, netbooks, NAS devices, control hubs, and a wide array of things we don’t even know about. The positioning of Atom compared to Core was meant to be that Atom was the smaller core design, taking up less silicon die area and being lower performance, but ultimately lower power in a time where the Core microarchitecture was focused more towards high performance designs.

The last few generations of Atom are readily quantified: Silvermont based on 22nm was a big product for the company, which has evolved into Airmont, Goldmont, Goldmont Plus, and now Tremont.

The Atom family lines get a little confusing with Intel playing in all these spaces. The Atom core within in given family is usually identical (L2 configuration might change), and because of the SoC in play, it might get a different name based on the market where it was headed. Intel scrapped the smartphone program back with Broxton in 2016, and the tablet type of SoC has also gone away. With Lakefield, combining Core and Atom, it could be used in Tablets again for 2019/2020, but we will see it in Notebooks with the Surface Pro Neo and in networking/embedded markets as Snow Ridge.

It is worth noting that as Intel expanded the scope of its Core microarchitecture, from 1.5W per core to 20W+ per core, it has kind of edged Atom more into niche products. Atom still had that super-low-power advantage, with a much smaller die area, but has also been super low performance with a quantifiable step-function below what Core can provide. With Tremont, Intel’s primary focus was bringing the single thread performance of the Atom design in parity to Core at the lower end of performance, with a sizeable overlap between the performance of a single Core design against a single Atom design. Intel published this graph to demonstrate what this looks like on early silicon.

Now, Intel’s Atom platforms haven’t had the greatest press over the last few years. Aside from providing some really nice notebooks around the $200 range on the consumer side, the enterprise side has been dealing with a clock degradation issue that ultimately leaves Atom systems built on C2000 processors unable to boot, which was bad news for embedded Atom systems designed to run for 10-20 years. Intel has since fixed that bug with a silicon update, but the point of that silicon was for it not to be touched for a generation.
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