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One of the promises that Intel has made with its new X[sup]e[/sup] GPU family is that in its various forms it will cater to uses ranging from integrated graphics all the way up to the high performance compute models needed for super-dense supercomputers. This means support for the types of calculations involved in simple graphics, complex graphics, ray tracing, AI inference, AI training, and the compute that goes into molecular modelling, oil-and-gas, nuclear reactors, rockets, nuclear rockets, and all the other big questions where more compute offers more capabilities. Sitting near the top of Intel’s offerings is the X[sup]e[/sup]-HP architecture, designed to offer high performance GPUs for standard server and enterprise deployments.

Over the past couple of weeks Intel has offered some of the first technical details of X[sup]e[/sup]-HP, following Raja Koduri showing it off across his social media profiles. We know that it is designed to be a modular architecture, with different chiplets connected together using Intel’s Embedded Multi-Die Interconnect Bridge technology. We also know, due to disclosures made at Intel’s Architecture Day, that it is set to be built on Intel’s 10nm Enhanced SuperFin (10ESF, formerly 10++, formerly 10+++) manufacturing process, which we believe to be a late 2021 process. Raja Koduri promised during the Architecture Day presentation that X[sup]e[/sup]-HP (and X[sup]e[/sup]-HPG) will be available in 2021.

Intel explained that the modular Xe-HP design will scale from one to four tiles, and the concept of Xe-HP was to ‘scale everything’, such as execution units, frequency, bandwidth, IPC, and math capabilities. We assume that each tile will have direct access to some on-chip memory as well – truly scaling up every aspect of a chip – although how the chip's HBM2E is allocated hasn't been confirmed. The point of the product is that it is designed for the data-center, so there needs to be a mix of media compute as well as raw compute, covering all sorts of uses cases.

As part of the demonstration during Architecture Day, Intel also showcased that they’ve been running some benchmarks on the early silicon in the labs. By early silicon, we mean that these aren’t running at the final frequencies, this isn’t final firmware, and the software stack still has a way to go, so undoubtedly there are optimizations at every level.
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