Hardware News
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Threads
- The Snapdragon 855 Phone Roundup: Searching for the Best Implementations (0 Replies)
- USB 4: Everything We Know So Far (0 Replies)
- Intel’s Next-Generation ‘Cascade Lake-X’ HEDT CPUs Due in October (0 Replies)
- Intel to Launch Core i9-9900KS Next Month: 5 GHz on All Cores (0 Replies)
- 8K Association Sets Minimal Specs for 8K Ultra-HD TVs (0 Replies)
- Samsung Announces Exynos 980 - Mid-Range With Integrated 5G Modem (0 Replies)
- Best Consumer Hard Drives: Q3 2019 (0 Replies)
- Dual AMD EPYC 7742 Crushes Quad Intel Xeon 8180M's In Geekbench 4 (0 Replies)
- Intel’s LGA4189-4 and LGA4189-5 for Cooper Lake & Ice Lake CPUs Now Available (0 Replies)
- Best Motherboards: Q3 2019 (0 Replies)
- Qualcomm Updates Wi-Fi 6 Lineup: Networking Pro Series for APs and FastConnect for Cl (0 Replies)
- Phison Previews Next-Gen PCIe 4.0 SSD Controllers: Up to 7 GB/s, NVMe 1.4 (0 Replies)
- Dell’s XPS 13 2-in-1 7390 Available: Intel’s 10th Gen Core CPUs Inside (0 Replies)
- Samsung Announces Always-Connected Galaxy Book S Laptop with Snapdragon 8cx (0 Replies)
- AMD Rome Second Generation EPYC Review: 2x 64-core Benchmarked (0 Replies)
- Samsung Announces the Exynos 9825 SoC: First 7nm EUV Silicon Chip (0 Replies)
- Samsung Unveils 6th Generation V-NAND Memory with Up to 136 Layers (0 Replies)
- Intel to Offer Socketed 56-core Cooper Lake Xeon Scalable in new Socket Compatible (0 Replies)
- Toshiba Introduces New Tiny NVMe SSD Form Factor (0 Replies)
- Honor Announces MagicBook Pro with 16.1-Inch Display (0 Replies)